@inproceedings{inproceedings, title = {{Thermal stability of self-assembled monolayer copper preservatives for fluxless soldering}}, url = {{}}, year = {{2006}}, month = {{1}}, author = {{Ebbens SJ and Hutt DA and Liu CQ}}, journal = {{ESTC 2006: 1st Electronics Systemintegration Technology Conference, Vols 1 and 2, Proceedings}}, pages = {{1360-1366}}, note = {{Accessed on 2025/05/25}}}