@article{article, title = {{Effect of temperature and storage environment on the preservation of copper surfaces for fluxless soldering}}, url = {{}}, year = {{2006}}, month = {{1}}, author = {{Ebbens S and Hutt DA and Liu C}}, doi = {{10.1109/ECTC.2006.1645911}}, volume = {{2006}}, journal = {{Proceedings - Electronic Components and Technology Conference}}, pages = {{1847-1852}}, note = {{Accessed on 2025/05/24}}}