TY - JOUR T1 - Effect of temperature and storage environment on the preservation of copper surfaces for fluxless soldering JO - Proceedings - Electronic Components and Technology Conference PY - 2006/01/01 AU - Ebbens S AU - Hutt DA AU - Liu C ED - DO - DOI: 10.1109/ECTC.2006.1645911 VL - 2006 SP - 1847 EP - 1852 Y2 - 2025/05/22 ER -