TY - CONF T1 - Modelling the enhancement to the thermal performance of encapsulants using thermally conductive filler materials JO - PCIM Asia Conference Proceedings PY - 2015/06/24 AU - Hewitt D AU - Stone DA AU - Foster MP ED - PB - Stuttgart, Germany; Mesago PCIM GmbH; [2014] Y2 - 2025/05/22 ER -