TY - JOUR T1 - Microstructure characterization and creep behavior of Pb-free Sn-rich solder alloys: Part I. Microstructure characterization of bulk solder and solder/copper joints JO - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science PY - 2008/01/09 AU - Sidhu RS AU - Chawla N ED - DO - DOI: 10.1007/s11661-007-9414-0 VL - 39 IS - 2 SP - 340 EP - 348 Y2 - 2025/06/24 ER -